Technological
equipment provided by NLS
Semiconductor etching facility PlasmaLab System 100 (Oxford Instruments)
The
Clean Room B (optical lithography,
class
1000, 2 local areas – class 100)
(temperature
stability ±1Ñ,
humidity* stability ±3%)
1) Mask
aligner (Optical lithography system)
SUSS MicroTec MJB-4
2)
Resist spinner SUSS DELTA 10-12
3) Pre- postprocessing cluster for structures fabrication
a) Ultrasonic
bath
b)
Water bath
c)
Vacuum oven
d)
Resist droppers
e)
Water purification system
f) Blow
guns (N2)
4)
Vertical laminar flow station
5) Fume
hood
6) Chemicals
(chemically pure)
The
clean room A (EBM lithography,
class
1000, 1 local area class 100)
(temperature
stability ±1Ñ)
1) Vertical
flow station
2) Thermal
evaporation facility
3) EBM
lithohraphy system
4)
Chemicals (chemically pure)
We
use the following photo resists: AZ5214E, Ma-N2400, PMMA 250K,
PMMA950K, PMGI, S1811.
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